Siemens has signed an exclusive OEM agreement with Alphawave Semi to market high-speed interconnect silicon IP solutions. This collaboration aims to meet the growing demand for scalable chip architectures in areas including: Artificial intelligence (AI), High-performance computing (HPC), Data networking, Autonomous vehicles, Hyperscaling and Storage. … Read More
Market Trends & Industry Updates
DVCon U.S. 2025: Exploring the Future of Design and Verification
DVCon U.S. 2025, the premier conference for design and verification professionals, returns to San Jose, California, from February 24 – 27, 2025. Hosted at the DoubleTree by Hilton, the agenda will feature in-depth technical sessions, keynotes and panels, showcasing the latest advancements in verification methodologies, hardware design, low-power design and power optimization strategies. With a strong focus on chip design and the role of AI and ML in verification, attendees will be exploring how these ever-evolving technologies are transforming traditional processes. … Read More
Mercedes-Benz Enhances In-Car Experience with Google Cloud’s Automotive AI Agent
Mercedes-Benz enhances in-car experience for users with MBUX Virtual Assistant powered by Google Cloud’s transformative Automotive AI Agent. The newly unveiled technology, built using Gemini with Vertex AI, will enable the automaker to deliver user-friendly conversational navigation search. Furthermore, users can expect hands-free functionality, real-time updates, improved route-planning with dynamic updates and faster, more accurate responses. … Read More
Valeo and AWS Accelerate SDV Development in Strategic Collaboration
Valeo and AWS accelerate Software-Defined Vehicle development with a strategic collaboration to deliver powerful cloud-based solutions. Together they will support quick and efficient development, testing, and validation of distributed vehicle software stacks across vehicle domains like Advanced Driver Assistance Systems (ADAS), infotainment systems, and Autonomous Mobility (AM). … Read More
TSMC Achieves New Milestone With 60% Yield in Successful 2nm Trial Production
TSMC has made a major breakthrough in advanced semiconductor manufacturing with its 2nm technology. The company achieved a reported 60% yield in a recent trial production run, bringing it closer to full-scale volume production. According to details shared at IEDM 2024, TSMC’s N2 technology promises a 30% power improvement and 15% performance gain over the precious 3nm node. Optimized for AI, mobile and HPC applications, this technology delivers significant advantages for chip designers, including increased performance, higher density, reduced power consumption and advanced power management capabilities. … Read More
Alchip’s New Automotive ASIC Platform
Alchip Introduces Revolutionary Automotive ASIC Design Platform for Advanced Driving Solutions In a significant advancement for the automotive industry, Alchip Technologies, Ltd. has recently introduced a groundbreaking Automotive ASIC platform. This innovative platform is tailored to meet the intricate requirements of the … Read More