2025 is shaping up to be a landmark year for the EDA landscape. By leveraging cutting-edge AI and accelerated computing with the NVIDIA Grace Blackwell platform, Synopsys is focused on transforming chip design and powering the future of semiconductor innovation. … Read More
Semiconductor Trends
Marvell Advances AI & Cloud Innovation with TSMC’s 2nm Silicon
Marvell has successfully demonstrated its next-generation 2nm silicon IP platform, designed to boost AI and cloud infrastructure innovation. … Read More
An Essential Guide to Semiconductor Events in 2025
Looking for the top semiconductor events to attend in 2025? Whether you’re an ASIC designer, verification engineer or embedded systems specialist, staying ahead of the latest industry advancements is crucial. Our guide highlights 25+ conferences, expos and user meetings across North America, EMEA and beyond, covering key themes like AI-driven chip design, verification methodologies, embedded systems design and semiconductor manufacturing. … Read More
2025 Semiconductor Event Calendar
Planning your year ahead and looking for top semiconductor events to attend? Our curated calendar features over 20 key events across North America and EMEA. Whether you’re focused on design/verification or want to explore broader industry trends, attending events like this is an excellent way to sharpen your technical skills, expand your professional network and accelerate career progression. Keep scrolling for a general calendar overview and stay tuned for our next article which will take a closer look at each event. … Read More
Siemens Partners with Alphawave Semi for Advanced Silicon IP Solutions
Siemens has signed an exclusive OEM agreement with Alphawave Semi to market high-speed interconnect silicon IP solutions. This collaboration aims to meet the growing demand for scalable chip architectures in areas including: Artificial intelligence (AI), High-performance computing (HPC), Data networking, Autonomous vehicles, Hyperscaling and Storage. … Read More
DVCon U.S. 2025: Exploring the Future of Design and Verification
DVCon U.S. 2025, the premier conference for design and verification professionals, returns to San Jose, California, from February 24 – 27, 2025. Hosted at the DoubleTree by Hilton, the agenda will feature in-depth technical sessions, keynotes and panels, showcasing the latest advancements in verification methodologies, hardware design, low-power design and power optimization strategies. With a strong focus on chip design and the role of AI and ML in verification, attendees will be exploring how these ever-evolving technologies are transforming traditional processes. … Read More
Mercedes-Benz Enhances In-Car Experience with Google Cloud’s Automotive AI Agent
Mercedes-Benz enhances in-car experience for users with MBUX Virtual Assistant powered by Google Cloud’s transformative Automotive AI Agent. The newly unveiled technology, built using Gemini with Vertex AI, will enable the automaker to deliver user-friendly conversational navigation search. Furthermore, users can expect hands-free functionality, real-time updates, improved route-planning with dynamic updates and faster, more accurate responses. … Read More
TSMC Achieves New Milestone With 60% Yield in Successful 2nm Trial Production
TSMC has made a major breakthrough in advanced semiconductor manufacturing with its 2nm technology. The company achieved a reported 60% yield in a recent trial production run, bringing it closer to full-scale volume production. According to details shared at IEDM 2024, TSMC’s N2 technology promises a 30% power improvement and 15% performance gain over the precious 3nm node. Optimized for AI, mobile and HPC applications, this technology delivers significant advantages for chip designers, including increased performance, higher density, reduced power consumption and advanced power management capabilities. … Read More