Siemens and Alphawave Semi partner to offer cutting-edge silicon IP solutions, accelerating customer time-to-market for AI, HPC and beyond. … Read More
Author Archives: collins.amy
Accellera Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard
Accellera approves UVM-MS 1.0 to streamline mixed-signal verification with automation, co-simulation and faster verification cycles. … Read More
LPDDR6 Design & Test Workflow Solution Unveiled by Keysight
Learn about the first comprehensive solution for LPDDR6 memory, built to revolutionize speed, efficiency and reliability for AI Edge rollout. … Read More
DVCon U.S. 2025: Exploring the Future of Design and Verification
Stay ahead in chip design and verification at DVCon U.S. 2025. Discover how AI/ML is driving the next wave of industry advancements. … Read More
Mercedes-Benz Enhances In-Car Experience with Google Cloud’s Automotive AI Agent
Mercedes-Benz Enhances In-Car Experience by integrating Google’s new Gen AI system to enable seamless, multi-turn dialogues. … Read More
Valeo and AWS Accelerate SDV Development in Strategic Collaboration
Valeo and AWS accelerate SDV development with solutions unveiled at CES 2025 aimed at streamlining processes across the automotive industry. … Read More
The Power of Trillium: Advancing AI with Google’s Sixth-Generation TPUs
Google Trillium sixth-generation TPUs are now generally available through Google Cloud Platform. Driven by the rising demands of generative AI, Trillium was designed to provide businesses and developers with the necessary power to advance AI development. … Read More
TSMC Achieves New Milestone With 60% Yield in Successful 2nm Trial Production
TSMC achieves a 60% yield in 2nm trial production reporting 30% power savings & 15% performance gains, driving innovation in AI, HPC and more. … Read More